Flexible substrate and manufacturing method thereof, manufacturing method of display panel and display device

ABSTRACT

The present disclosure provides a flexible substrate, a method for manufacturing the same, a method for manufacturing a display panel and a display device. The flexible substrate has sub-pixel regions and an inter-subpixel region between adjacent sub-pixel regions. The flexible substrate includes a support layer including a plurality of micro-grooves, and the plurality of micro-grooves are on one side of the support layer and in the inter-subpixel region.

TECHNICAL FIELD

The present disclosure relates to the field of display technology, moreparticularly, to a flexible substrate, a method for manufacturing thesame, a method for manufacturing a display panel and a display device.

BACKGROUND

With the development of science and technology, flat panel displaydevices have replaced cumbersome CRT display devices and are widely usedin people's daily lives. At present, commonly used flat panel displaydevices include LCD (Liquid Crystal Display) and OLED (OrganicLight-Emitting Diode) display devices. Compared with an LCD device, anOLED display device has the advantages of being self-luminous andflexible, and the like.

In recent years, the flexible display technology has developed rapidly,and various flexible display screen development plans have emerged in anendless stream, involving fields of displays, wearable devices and thelike. A flexible display screen is stretchable, and therefore imposesspecial requirements on its substrate, thin film transistor (TFT),light-emitting device, circuit arrangement and the like.

SUMMARY

The present disclosure provides a flexible substrate, a method formanufacturing the same, a method for manufacturing a display panel, anda display device.

In one aspect, the present disclosure provides a flexible substratehaving sub-pixel regions and an inter-subpixel region between adjacentsub-pixel regions, wherein the flexible substrate includes a supportlayer, the support layer includes a plurality of micro-grooves, and theplurality of micro-grooves are on one side of the support layer and inthe inter-subpixel region.

In an embodiment of the present disclosure, the flexible substratefurther includes an extension layer, the extension layer is on a side ofthe support layer where the plurality of micro-grooves are not disposed,and includes a first region and a second region, and an elastic modulusof the first region is greater than an elastic modulus of the secondregion.

In an embodiment of the present disclosure, the extension layer is madeof a material capable of being modified by light irradiation.

In an embodiment of the present disclosure, the extension layer is madeof polydimethylsiloxane.

In an embodiment of the present disclosure, the flexible substrateincludes a display area and a non-display area, the sub-pixel regionsand the inter-subpixel region are in the display area, the non-displayarea includes a bonding region provided with a contact, and part of theplurality of micro-grooves is located in a region of the non-displayarea other than the bonding region.

In an embodiment of the present disclosure, the flexible substratefurther includes a control element on a side of the support layer distalto the extension layer, wherein the control element is in the sub-pixelregion, and an orthographic projection of the control element on theextension layer is within the first region of the extension layer.

In an embodiment of the present disclosure, depths of the micro-groovesare no greater than one tenth of a thickness of the support layer.

In an embodiment of the present disclosure, the micro-grooves arecircular grooves or rectangular grooves.

In an embodiment of the present disclosure, the micro-grooves are evenlydistributed in the inter-subpixel region.

In an embodiment of the present disclosure, the support layer is made ofpolyimide.

In another aspect, the present disclosure provides a method formanufacturing a flexible substrate having sub-pixel regions and aninter-subpixel region between adjacent sub-pixel regions, the methodincluding:

providing a support film layer; and

forming a plurality of micro-grooves in the inter-subpixel region on asurface of the support film layer, thereby forming a support layer.

In an embodiment of the present disclosure, the method further includesforming an extension layer on a side of the support layer where theplurality of micro-grooves are not formed, wherein the extension layerincludes a first region and a second region, and an elastic modulus ofthe first region is greater than an elastic modulus of the secondregion.

In an embodiment of the present disclosure, the extension layer isformed of a material capable of being modified by light irradiation, andthe method further includes:

irradiating the first region of the extension layer with ultravioletlight without irradiating the second region of the extension layer suchthat the elastic modulus of the first region is greater than the elasticmodulus of the second region.

In an embodiment of the present disclosure, the flexible substrateincludes a display area and a non-display area, the sub-pixel regionsand the inter-subpixel region are located in the display area, and thenon-display area includes a bonding region provided with a contact; andthe method further includes:

forming, in the surface of the support film layer, a plurality ofmicro-grooves in a region in the non-display area other than the bondingregion.

In an embodiment of the present disclosure, the plurality ofmicro-grooves are formed by at least one of a laser ablation method, adry etching method, a wet etching method, and a nanoimprint method.

In an embodiment of the present disclosure, forming the plurality ofmicro-grooves in the inter-subpixel region in the surface of the supportfilm layer includes:

forming a resist layer on the surface of the support film layer;

patterning the resist layer such that the patterned resist layerincludes a resist removed region and a resist remaining region;

etching a part of the support film layer corresponding to the resistremoved region using an etching medium to form the plurality ofmicro-grooves; and

removing the resist layer.

In an embodiment of the present disclosure, the method further includes:

forming a control element on a side of the support layer distal to theextension layer, wherein the control element is in the sub-pixel region,and an orthographic projection of the control element on the extensionlayer is within the first region of the extension layer.

In still another aspect, the present disclosure provides a method formanufacturing a display panel, including:

providing a support layer of the flexible substrate according to thepresent disclosure on a base substrate;

forming a control element at a corner of the sub-pixel region on a sideof the support layer where the micro-grooves are disposed;

forming a light-emitting device in the sub-pixel region on a side of thecontrol element distal to the micro-grooves; and

separating the support layer from the base substrate.

In an embodiment of the present disclosure, the method further includes:

transferring the support layer on which the control element and thelight-emitting device are formed onto an extension layer, wherein asurface of the support layer where the micro-grooves are not provided isin contact with the extension layer, and an area covered by anorthographic projection of the control element on the extension layer isa first region of the extension layer;

irradiating the first region of the extension layer with ultravioletlight without irradiating a region of the extension layer other than thefirst region, such that an elastic modulus of the first region isgreater than an elastic modulus of the region of the extension layerother than the first region.

In still another aspect, the present disclosure provides a displaydevice including a display panel formed using the method according tothe present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic plan view of a part of a flexible substrateaccording to an embodiment of the present disclosure;

FIG. 1B is a partially enlarged view of portion B of the flexiblesubstrate shown in FIG. 1A;

FIG. 2 is a cross-sectional view taken along line AA of the flexiblesubstrate shown in FIG. 1B;

FIGS. 3A to 3C illustrate a manufacturing process of a flexiblesubstrate according to an embodiment of the present disclosure;

FIG. 4A is a schematic plan view of irradiating an extension layer withultraviolet light to form a reinforcement region;

FIG. 4B illustrates proportions of components in the extension layer(PDMS) before and after the ultraviolet irradiation;

FIG. 5A to 5E illustrate a manufacturing process of a flexible displaypanel according to an embodiment of the present disclosure;

FIG. 6A is a schematic plan view of the structure shown in FIG. 5C; and

FIG. 6B is a schematic plan view of the structure shown in FIG. 5E.

DETAILED DESCRIPTION

In order to enable those skilled in the art to better understand thetechnical solutions of the present disclosure, a flexible substrate, amanufacturing method thereof, a manufacturing method of a display panel,and a display device of the present disclosure are further described indetail below with reference to the accompanying drawings and specificimplementations.

In a flexible substrate, a thin film transistor is formed on asubstrate. In order to adapt to the stretchable property, the thin filmtransistor is generally formed into a separate island structure to avoiddamage to a display device during the stretching. However, in general,since the flexible substrate is relatively thick and has a relativelylarge elastic modulus, it is difficult to stretch or deform the flexiblesubstrate, and the flexible substrate may even be broken.

Accordingly, the present disclosure provides, inter alia, a flexiblesubstrate, a method for manufacturing a flexible substrate, a method formanufacturing a display panel, and a display device, that substantiallyobviate one or more of the problems due to limitations and disadvantagesof the related art. In one aspect, the present disclosure provides aflexible substrate having sub-pixel regions and an inter-subpixel regionbetween adjacent sub-pixel regions. The flexible substrate includes asupport layer including a plurality of micro-grooves, the plurality ofmicro-grooves are on one side of the support layer and in theinter-subpixel region.

As used herein, the sub-pixel region refers to a light-emitting regionof a sub-pixel, such as a region in a liquid crystal displaycorresponding to a pixel electrode, or a region in an organiclight-emitting diode display panel corresponding to a light-emittinglayer. In an embodiment, a pixel may include a number of individuallight-emitting regions corresponding to a number of sub-pixels in thepixel. Optionally, the sub-pixel region is a light-emitting region of ared sub-pixel. Optionally, the sub-pixel region is a light-emittingregion of a green sub-pixel. Optionally, the sub-pixel region is alight-emitting region of a blue sub-pixel. Optionally, the sub-pixelregion is a light-emitting region of a white sub-pixel. As used herein,the inter-subpixel region refers to a region between adjacent sub-pixelregions, such as a region in a liquid crystal display corresponding to ablack matrix, or a region in an organic light-emitting diode displaypanel corresponding to a pixel define layer. Optionally, theinter-subpixel region is a region between adjacent sub-pixel regions ina same pixel. Optionally, the inter-subpixel region is a region betweentwo adjacent sub-pixel regions from two adjacent pixels. Optionally, theinter-subpixel region is a region between the sub-pixel region of a redsub-pixel and the sub-pixel region of a green sub-pixel adjacent to thered sub-pixel. Optionally, the inter-subpixel region is a region betweenthe sub-pixel region of a red sub-pixel and the sub-pixel region of ablue sub-pixel adjacent to the red sub-pixel. Optionally, theinter-subpixel region is a region between the sub-pixel region of agreen sub-pixel and the sub-pixel region of a blue sub-pixel adjacent tothe green sub-pixel.

FIG. 1A is a schematic plan view of a part of a flexible substrateaccording to an embodiment of the present disclosure; FIG. 1B is apartially enlarged view of portion B of the flexible substrate shown inFIG. 1A; and FIG. 2 is a cross-sectional view taken along line AA of theflexible substrate shown in FIG. 1B.

A flexible substrate according to an embodiment of the presentdisclosure is configured to bear a flexible display device. As shown inFIG. 1A, the flexible substrate has sub-pixel regions 10 and aninter-subpixel region 11 between adjacent sub-pixel regions. As shown inFIGS. 1A, 1B and 2, the flexible substrate includes a support layer 2including a plurality of micro-grooves 20, and the plurality ofmicro-grooves 20 are on one side of the support layer 2 and in theinter-subpixel region 11. The flexible substrate according to theembodiment of the present disclosure can provide sufficient ductilitywhile ensuring support performance. In the case of using the flexiblesubstrate to form a display panel, the micro-grooves 20 are provided ona side of the support layer 2 where the flexible display device is to bedisposed, that is, the openings of the micro-grooves 20 face theflexible display device. In the flexible substrate, due to the presenceof the micro-grooves 20, a concave and convex structure havingnon-uniform thicknesses is formed on the side of the support layer 2.Under the action of a same external force, a region having a smallerthickness is stretched more easily, and can absorb stress more easily.As such, stress is prevented from accumulating in the sub-pixel regionsto cause damage to the structure in the sub-pixel regions. Therefore, byhaving the micro-grooves 20 in the inter-subpixel region 11 of theflexible substrate, the stress is offset by material deformation in theinter-subpixel region, thereby cancelling out impact of the stress andpreventing the sub-pixel regions from being damaged by the stress.

In some embodiments, the flexible substrate further includes anextension layer 6 on a side of the support layer 2 on which themicro-grooves 20 are not provided. In an embodiment, the extension layer6 is made of a material that can be modified by light irradiation. Thepurpose of modification by light irradiation is to increase the elasticmodulus of a material, making the material less deformable. By providingthe extension layer 6, which can be partially modified, on the side ofthe support layer 2 where the micro-grooves 20 are not provided,sufficient support performance is provided for a portion or regionhaving a specific requirement while ensuring ductility.

In some embodiments, the flexible substrate further includes a controlelement 3 located within the sub-pixel region 10 and on a side of thesupport layer 2 distal to the extension layer 6.

Generally, the flexible display device is supported by the support layerof the flexible substrate, each sub-pixel region 10 is provided thereinwith the control element 3, a region of the extension layer 6corresponding to the control element 3 is modified by light into areinforcement region 60 (in the plan view of FIG. 1B, the reinforcementregion 60 overlaps with the region where the control element 3 islocated), and the elastic modulus of the reinforcement region 60 isgreater than the elastic modulus of a region of the extension layer 6other than the reinforcement region 60. The control element 3, as a coreelement for controlling display of the pixel, typically cannot bestretched to avoid damage thereto and influence on the performance ofthe control element 3.

As shown in FIG. 1B, the control element 3 is generally disposed at acorner of the sub-pixel region 10, for example, near the edge of thesub-pixel region 10 and close to the inter-subpixel region 11, andalternatively, the control element may be disposed throughout the entiresub-pixel region, which is not limited. With the above design, theinter-subpixel region 11 is provided with the micro-grooves 20 to havegood ductility, and at the same time, the region (second region) of theextension layer 6 other than the reinforcement region 60 (first region)corresponding to the control element 3 is not modified by light, andthus still has good ductility, thereby ensuring the stretchable propertyof the entire flexible substrate. At the same time, the reinforcementregion 60 has increased hardness and is not easily deformed after beingmodified by light. Therefore, the control element 3 on the reinforcementregion 60 is less likely to be deformed, so that the performance of thecontrol element 3 can be effectively ensured.

In some embodiments, the control element 3 is a thin film transistor(TFT), and is configured to, for example, provide a display controlsignal to the pixel. The thin film transistor includes a gate, a sourceand a drain. For example, a scan signal is received by the gate, adisplay data signal is received by the source, and then the display datasignal is output to an anode of a light-emitting device 4 (e.g., anorganic light-emitting diode; OLED for short) through the drain tocontrol light emission of the light-emitting device 4. The region of theextension layer 6 that does not undergo light modification is soft andhas good stretchability, and the region of the extension layer 6 thatundergoes light modification is relatively hard and can maintain thecharacteristics of the thin film transistor. In addition, since theinter-subpixel region is provided with the micro-grooves 20, stress canbe released at positions in the grooves having a relatively smallthickness during stretching, so that bending or stretching can be easilyachieved, and damage due to accumulation of stress can hardly be causedto the flexible substrate.

It should be understood here that in the sub-pixel region 10, a region,other than the region where the thin film transistor is disposed, may bepatterned to have a groove without affecting the electrical performanceof the thin film transistor. Comprehensively considering deformation ofthe pixel structure, the light-emitting area and mixing effect ofdifferent colors, a micro-groove may be formed in the sub-pixel region,so as to provide more regions for releasing stress, which facilitatesimproving the stretchability and bendability of the flexible substrate,making the flexible substrate have better ductility.

The display control signals supplied to the control element 3 include ascan signal and a display data signal. Each control element 3 isconnected to a gate line and a data line, respectively, and the scansignal is transmitted through a scan line or a gate line, and thedisplay data signal is transmitted through a data line. In the flexiblesubstrate of the embodiment, the gate line and the data line aredisposed in the inter-subpixel region 11 between adjacent sub-pixelregions 10. The inter-subpixel region 11 undergoes large deformationwhen stretching the flexible substrate, so as to release stress. Sincethe gate line and the data line are mainly made of a metal material,which has relatively good ductility and bendability, they can hardly bedamaged when stretching and bending the flexible substrate.

Since the region having a small thickness has good ductility and poorsupport performance, depths of the micro-grooves 20 can be reasonablyset in practical applications. In an embodiment, the depths of themicro-grooves 20 are no greater than one tenth of the thickness of thesupport layer 2. The micro-grooves 20 having a thickness in this rangecan achieve a good balance between ductility and support performance.

In some embodiments, as shown in FIG. 1B, the micro-grooves 20 arecircular grooves or rectangular grooves. The above shapes of themicro-grooves 20 can ensure convenience of process and obtain highprocess yield. In a practical process, a wall thickness between thecircular grooves is larger; however, the rectangular groove has a largergrooved area, which is more conducive to deformation and stress release.

In an embodiment, the micro-grooves 20 are evenly distributed in theinter-subpixel region 11 between adjacent sub-pixel regions 10 to ensureuniformity of stress release.

In some embodiments, the flexible substrate includes a display area anda non-display area, the sub-pixel regions and the inter-subpixel regionare located in the display area, the non-display area includes a bondingregion provided with a contact, and a plurality of micro-grooves areprovided in a region, other than the bonding region, in the non-displayarea.

In some embodiments, the support layer 2 is made of polyimide and theextension layer 6 is made of polydimethylsiloxane (PDMS for short). PDMShas good stretchability and can be used as a back film material for astretchable display. After PMDS is irradiated with ultraviolet light(UV), its components change, and it becomes hard and can hardly bedeformed. The region of the extension layer 6 that is irradiated withultraviolet light and the region of the extension layer 6 that is notirradiated with ultraviolet light correspond to the reinforcement regionand the non-reinforcement region, respectively, and stress can bereleased in the non-reinforcement region. The materials of the supportlayer 2 and the extension layer 6 are easily obtained, which isadvantageous for reducing cost.

In another aspect, embodiments of the present disclosure also provide amethod for manufacturing the flexible substrate. The flexible substratemay be used to bear a flexible display device. The flexible substratehas sub-pixel regions 10 and an inter-subpixel region 11 betweenadjacent sub-pixel regions. The flexible substrate includes a supportlayer 2 including a plurality of micro-grooves 20, and the plurality ofmicro-grooves 20 are located on one side of the support layer 2 and inthe inter-subpixel region 11. By providing the micro-grooves 20 in aregion of the support layer 2 corresponding to the inter-subpixel region11, sufficient ductility can be provided while ensuring supportproperty.

FIGS. 3A to 3C illustrate steps in a method for manufacturing a flexiblesubstrate according to an embodiment of the present disclosure.

As shown in FIG. 3A, a support film layer 21 is provided on a basesubstrate 1.

As shown in FIG. 3B, a plurality of micro-grooves are formed in a part,corresponding to the inter-subpixel region, of a surface of the supportfilm layer 21, thereby forming a support layer. For example, a pluralityof micro-grooves 20 are formed in a part, corresponding to theinter-subpixel region 11 between adjacent sub-pixel regions 10, of asurface of the support film layer 21 by using at least one of: a laserablation method, a dry etching method, a wet etching method, and ananoimprint method.

In some embodiments, the step of forming the plurality of micro-grooves20 includes:

forming a resist layer on the surface of the support film layer 21, theresist layer being formed of, for example, SiOx material;

patterning the resist layer such that the patterned resist layerincludes a resist removed region and a resist remaining region;

etching a part of the support film layer 21 corresponding to the resistremoved region by using an etching medium to form the micro-grooves 20;for example, performing wet etching by using an etching solution, orperforming dry etching by using an etching gas; and

removing the resist layer.

In some embodiments, as shown in FIG. 3C, the manufacturing methodfurther includes forming an extension layer 6 on a side of the supportlayer 2 where the plurality of micro-grooves 20 are not formed, therebyproviding sufficient ductility while ensuring support property. Theextension layer 6 is formed of a material that can be modified by light.The surface layer of the extension layer 6 is modified by patternedultraviolet light irradiation, that is, part of the surface of theextension layer 6 is irradiated with light, and the other part of thesurface is not irradiated by light. In this way, the extension layer 6is patterned such that the region subjected to the light irradiation isrelatively hard, while the part of the extension layer 6 correspondingto the area of the micro-grooves still has relatively good ductility.

In some embodiments, the manufacturing method further includes forming acontrol element 3 on a side of the support layer 2 distal to theextension layer 6, the control element 3 being within the sub-pixelregion 10. In an embodiment, the manufacturing method further includes:as shown in FIG. 4A, irradiating a part, corresponding to the controlelement 3, of the surface of the extension layer 6 distal to the supportlayer 2 with ultraviolet light such that the part of the extension layer6 corresponding to the control element 3 is modified by light to form areinforcement region 60 having an elastic modulus greater than that ofother region than the reinforcement region 60. For example, maincomponents of the material PDMS of the extension layer 6 are C, O andSi. FIG. 4B shows proportions of components in the extension layer(PDMS) before and after ultraviolet light irradiation. As shown in FIG.4B, according to the detection result of X-ray photoelectronspectroscopy (XPS), as the irradiation time of ultraviolet lightincreases, a content of C in the reinforcement region 60 decreases, acontent of O increases, and a large amount of SiOx, which is hard anddoes not deform, is formed. The reinforcement region 60 is formed bypartially modifying the extension layer 6, and the reinforcement region60 is used to ensure the performance of the control element 3 locatedthereon.

It should be understood herein that all regions except the regioncorresponding to the micro-grooves of the extension layer 6 may bemodified by ultraviolet light irradiation. On the one hand, ductility isimproved by the micro-grooves of the support layer 2, and on the otherhand, support performance is enhanced by the light modification of theextension layer 6, which facilitate improving the stretchability andbendability of the flexible substrate.

In the flexible substrate of the present embodiment, a part of thesupport layer in the inter-subpixel region is patterned to formmicro-grooves, so that the support layer and a trace thereabove have aconvex and concave structure, and a part of the support layercorresponding to the control element is not provided with themicro-groove, and a part of the extension layer corresponding to thecontrol element is treated to be relatively hard, thereby obtaining astretchable flexible substrate, which is particularly suitable forsupporting a flexible display device.

According to an embodiment of the present disclosure, the flexiblesubstrate includes a display area and a non-display area in theperiphery of the display area. The sub-pixel regions and theinter-subpixel region are located in the display area, the non-displayarea includes a bonding region, and a part, in the non-display area butnot in the bonding region, of the support layer is provided thereon witha plurality of micro-grooves 20.

In an embodiment, in the region, other than the bonding region, in thenon-display area, the plurality of micro-grooves 20 are evenlydistributed. In an embodiment, the plurality of micro-grooves 20 have alarger density in a region near the edge than in an intermediate region.In an embodiment, among the plurality of micro-grooves 20, the size ofthe micro-groove 20 near the edge is larger than the size of themicro-groove 20 in the intermediate region. In the present disclosure,the size relationship of the plurality of micro-grooves 20 is notlimited thereto, as long as it is convenient to provide a trace in theinter-subpixel region. Under the action of a same stress, the regionhaving a smaller thickness has better ductility, and the surface area ofthe micro-groove increases upon application of a force. Here, the edgeis defined as a region where an external tensile force is applied forthe purpose of stretching, and the intermediate region is defined as aregion distal to a point of force application.

In the method for manufacturing the flexible substrate according to theembodiment of the present disclosure, since the flexible displaysubstrate further includes the non-display area located in the peripheryof the display area, a bonding region is provided in the non-displayarea, and the manufacturing method includes: in the step of forming theplurality of micro-grooves 20 in the inter-subpixel region 11, alsoforming a plurality of micro-grooves 20 in a region, other than thebonding region and in the non-display region, of the surface of thesupport layer 2 by using laser ablation or dry etching, (themicro-grooves 20 in the inter-subpixel region and the micro-grooves 20in the non-display region may be formed simultaneously), and thespecific manufacturing method may refer to the foregoing embodiments. Acontact is provided in the bonding region, and a signal is transmittedbetween the contact and a signal point of a driving control board. Themicro-groove is not provided in a region corresponding to the bondingregion, so as to ensure the support performance of the region, andensure accurate alignment between the contact and the signal point.

In the flexible substrate of the embodiment, the support layer ispatterned in both the display area and the non-display area to formmicro-grooves, which ensures the ductility of the flexible substrate asa whole, and provides a good support system for flexible display.

In another aspect, embodiments of the present disclosure provide amethod for manufacturing a display panel. In some embodiments, thedisplay panel is a flexible display panel.

The flexible substrate described above is part of the flexible displaypanel. FIGS. 5A to 5E illustrate a manufacturing process of a flexibledisplay panel according to an embodiment of the present disclosure.

First, as shown in FIG. 5A, a support film layer 21 of theabove-described flexible substrate is disposed on a base substrate 1.The support film layer 21 is disposed on the base substrate 1, and thesupport film layer 21 is patterned (by a depth less than 500 Å) usinglaser etching to form the micro-grooves 20 shown in FIG. 5B, and themicro-grooves 20 are distributed all over a region of the support layer2 corresponding to the inter-subpixel region 11.

Next, as shown in FIG. 5C, a control element is formed on the side ofthe support layer 20 where the micro-grooves are provided, and thecontrol element is in the sub-pixel region 10. In FIGS. 5C and 6A, thecontrol element 3 is formed on the support layer 2, and located at acorner of the sub-pixel region 10. Further, a light-emitting device 4 isformed in the sub-pixel region 10 on a side of the control element 3distal to the micro-grooves 20. In an embodiment, in the step of formingthe control element 3, the gate line and the data line aresimultaneously formed in the inter-subpixel region 11 between adjacentsub-pixel regions 10. By providing micro-grooves in the inter-subpixelregion 11 between adjacent sub-pixel regions 10, the ductility isimproved, and sufficient support in each sub-pixel region is ensured,thereby ensuring independence, flexibility and ductility of eachsub-pixel region. In an embodiment, an encapsulation layer 5 is formedon a side of the light-emitting device 4 distal to the control element3.

Next, the support layer is separated from the base substrate. As shownin FIG. 5D, the support layer 2 is irradiated with laser from the sideof the support layer 2 where the control element 3 is not provided, soas to separate the support layer 2 from the base substrate 1.

Then, the support layer on which the control element and thelight-emitting device are formed is transferred onto the extension layersuch that the surface of the support layer where the micro-grooves arenot provided is in contact with the extension layer. As shown in FIG.5E, the extension layer 6 is formed on a back surface of the supportlayer 2 with the control element 3, the light-emitting device 4, and theencapsulation layer 5, i.e., a surface, on which the control element 3,the light-emitting device 4, and the encapsulation layer 5 are notformed, of the support layer 2. Alternatively, the support layer 2 onwhich the control element 3, the light-emitting device 4 and theencapsulation layer 5 are formed is transferred onto the extension layer6. Since the support layer 2 has been separated from the base substrate1 at this time, the support layer 2 can be picked up by hand or amachine and attached to an extension layer 6 with an adhesive, so thatthe support layer 2 as well as the control element 3 and thelight-emitting device 4 thereon are transferred onto the extension layer6.

Finally, a region of the extension layer corresponding to the controlelement is modified by light irradiation from the side of the extensionlayer distal to the support layer to form a reinforcement region, andthe elastic modulus of the reinforcement region is greater than theelastic modulus of the region other than the reinforcement region. Asshown in FIG. 6B, the region of the extension layer 6 corresponding tothe control element 3 is irradiated with ultraviolet light from the sideof the extension layer 6 distal to the support layer 2, so that theregion of the extension layer 6 corresponding to the control element 3forms the reinforcement region 60, and the elastic modulus of thereinforcement region 60 is greater than the elastic modulus of theregion other than the reinforcement region 60.

By modifying the extension layer by light irradiation, the region of theextension layer corresponding to the control element (e.g., a thin filmtransistor) is formed into SiOx, which is relatively hard, therebyproviding support property while ensuring sufficient ductility.

In still another aspect, embodiments of the present disclosure provide adisplay device including a display panel manufactured using the methodaccording to the embodiments of the present disclosure, and the displaydevice has relatively good flexibility.

The display device may be any product or component having displayfunction, such as a desktop computer, a tablet computer, a notebookcomputer, a mobile phone, a PDA, a GPS, an on-board display, aprojection display, a camera, a digital camera, an electronic watch, acalculator, an electronic instrument, a meter, a LCD panel, anelectronic paper, a television, a display, a digital photo frame, anavigator, etc., and can be applied to many fields such as publicdisplay and unreal display.

It could be understood that the foregoing implementations are merelyexemplary implementations for explaining the principles of the presentdisclosure, but the present disclosure is not limited thereto. Variousmodifications and improvements may be made by those skilled in the artwithout departing from the spirit and scope of the present disclosure,and the modifications and improvements are also considered to be withinthe scope of the disclosure.

What is claimed is:
 1. A flexible substrate having sub-pixel regions andan inter-subpixel region between adjacent sub-pixel regions, wherein theflexible substrate comprises: a support layer, comprising a plurality ofmicro-grooves, wherein the plurality of micro-grooves are on one side ofthe support layer and in the inter-subpixel region; and an extensionlayer, which is on a side of the support layer where the plurality ofmicro-grooves are not disposed, and comprises a first region and asecond region, wherein an elastic modulus of the first region beinggreater than an elastic modulus of the second region.
 2. The flexiblesubstrate of claim 1, wherein the extension layer is made of a materialcapable of being modified by light irradiation.
 3. The flexiblesubstrate of claim 2, wherein the extension layer is made ofpolydimethylsiloxane.
 4. The flexible substrate of claim 1, wherein theflexible substrate comprises a display area and a non-display area, thesub-pixel regions and the inter-subpixel region are in the display area,the non-display area comprises a bonding region provided with a contact,and part of the plurality of micro-grooves is in a region of thenon-display area other than the bonding region.
 5. The flexiblesubstrate of claim 1, further comprising a control element on a side ofthe support layer distal to the extension layer, wherein the controlelement is in the sub-pixel region, and an orthographic projection ofthe control element on the extension layer is within the first region ofthe extension layer.
 6. The flexible substrate of claim 1, whereindepths of the micro-grooves are no greater than one tenth of a thicknessof the support layer.
 7. The flexible substrate of claim 1, wherein themicro-grooves are circular grooves or rectangular grooves.
 8. Theflexible substrate of claim 1, wherein the micro-grooves are evenlydistributed in the inter-subpixel region.
 9. The flexible substrate ofclaim 1, wherein the support layer is made of polyimide.
 10. Theflexible substrate of claim 1, wherein the support layer furthercomprises micro-grooves on the one side of the support layer and in partof the sub-pixel regions where no thin film transistor is provided. 11.A display panel, comprising: the flexible substrate of claim 1; andflexible display elements on a side of the support layer of the flexiblesubstrate where the micro-grooves are provided.
 12. A display device,comprising the display panel of claim
 11. 13. A method for manufacturinga flexible substrate, the flexible substrate having sub-pixel regionsand an inter-subpixel region between adjacent sub-pixel regions, themethod comprising: providing a support film layer; forming a pluralityof micro-grooves in the inter-subpixel region on a surface of thesupport film layer, thereby forming a support layer; and forming anextension layer on a side of the support layer where the plurality ofmicro-grooves are not formed, wherein the extension layer comprises afirst region and a second region, and an elastic modulus of the firstregion is greater than an elastic modulus of the second region.
 14. Themethod of claim 13, wherein the extension layer is formed of a materialcapable of being modified by light irradiation, and the method furthercomprises: irradiating the first region of the extension layer withultraviolet light without irradiating the second region of the extensionlayer such that the elastic modulus of the first region is greater thanthe elastic modulus of the second region.
 15. The method of claim 14,wherein the extension layer is made of polydimethylsiloxane.
 16. Themethod of claim 13, wherein the flexible substrate comprises a displayarea and a non-display area, the sub-pixel regions and theinter-subpixel region are located in the display area, and thenon-display area comprises a bonding region provided with a contact; andthe method further comprises: forming, in the surface of the supportfilm layer, a plurality of micro-grooves in a region in the non-displayarea other than the bonding region.
 17. The method of claim 13, whereinthe plurality of micro-grooves are formed by at least one of a laserablation method, a dry etching method, a wet etching method, and ananoimprint method.
 18. The method of claim 13, wherein forming theplurality of micro-grooves in the inter-subpixel region in the surfaceof the support film layer comprises: forming a resist layer on thesurface of the support film layer; patterning the resist layer such thatthe patterned resist layer comprises a resist removed region and aresist remaining region; etching a part of the support film layercorresponding to the resist removed region using an etching medium toform the plurality of micro-grooves; and removing the resist layer. 19.The method of claim 13, further comprising: forming a control element ona side of the support layer distal to the extension layer, wherein thecontrol element is in the sub-pixel region, and an orthographicprojection of the control element on the extension layer is within thefirst region of the extension layer.